In the manufacturing process of 12-inch wafers, even a deviation of just a few nanometers in thickness—whether in the tens-of-nanometers-thick gate oxide layer or the hundreds-of-micrometers-thick silicon substrate—can directly cause a significant drop in overall wafer yield. Similarly, in MiniLED display panel production, the thickness uniformity of quantum dot films directly determines screen color accuracy.  

For years, the industry has relied on two separate instruments for nanoscale thin-film and micrometer-scale substrate thickness measurement: spectrophotometric reflectometers and spectral-domain interferometers. Positioning misalignment and efficiency losses between these two sequential measurements have persistently hindered productivity and quality improvements on production lines.

To address this widespread industry challenge, Jingyi Optoelectronics’ R&D team adopted a dual-optical-path coaxial integration approach, breaking down the application barriers between the two technologies:  
- The visible-light path employs a highly stable, long-lifetime light source to capture the reflection spectrum of thin films; thickness is calculated at nanometer resolution using a fitting algorithm matched against a built-in material refractive index database.  
- The near-infrared path utilizes a superluminescent diode (SLD) module centered at 1550 nm to acquire the interference spectrum of the substrate; a proprietary model-based interference analysis algorithm effectively filters out signal interference from the overlying thin film, enabling direct micrometer-scale substrate thickness calculation.  
Both optical paths are coaxially combined via a dichroic beam splitter—enabling simultaneous acquisition of both film and substrate thickness data in a single scan, thereby eliminating positioning errors inherent in multiple discrete measurements.

The accompanying OPTICAFILMTEST inspection software embeds a multi-algorithm matrix covering diverse measurement scenarios—including Fourier transform methods, extremum detection, and dynamic fitting algorithms. Its open, built-in refractive index database allows users to add parameters for novel thin-film materials. Whether standard SiO₂ or SiN films—or emerging perovskite or biomedical thin films—the system rapidly adapts without manual recalibration. During measurement, the software displays real-time interference signal evolution, FFT spectral analysis results, and dynamic thickness trends—empowering R&D engineers to adjust deposition processes directly based on live data, eliminating the need for secondary post-processing.

This solution’s reliability has been validated through multiple rounds of mass-production-level testing: Scanning results on 450-μm silicon substrates coated with two SiO₂ layers (100 nm and 150 nm thick, respectively) showed a film thickness measurement uncertainty of only 0.12 nm (k = 2), and substrate thickness deviation controlled within ±8 nm. Comparative validation against internationally certified reference standards confirmed all measured values fall within their expanded uncertainty intervals, with En values consistently < 1—meeting the stringent accuracy requirements of high-end manufacturing.

As the commercialized product embodying this technology, Jingyi Optoelectronics’ Film Thickness Analyzer delivers fully non-contact, non-destructive measurement—ensuring zero damage to sensitive devices such as wafers and display panels. Its imported tungsten-halogen light source boasts a lifetime exceeding 10,000 hours, significantly reducing operational and maintenance costs on production lines. The instrument supports full-area mapping scanning mode: With one click, it generates an intuitive thermal map of thickness distribution across the entire sample—enabling rapid, comprehensive inspection even for large-format display panels. The software interface has been streamlined for ease of use; frontline operators require no advanced optics training to perform end-to-end measurements, achieving over 60% higher throughput compared to traditional multi-instrument workflows.

Currently deployed across semiconductor wafer fabrication, display panel coating, optical component machining, and biomedical thin-film R&D, this film thickness analyzer resolves longstanding pain points associated with cross-scale thickness measurement—including high equipment-integration costs, low efficiency, and large cumulative measurement errors. It provides reliable metrological support for process iteration and yield enhancement in high-end manufacturing. For customized inspection solutions, contact technical support at +86 180-1566-6117.

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