Nanometer-Level Thin-Film Thickness Measurement to Become a Core Manufacturing Requirement in 2025—Jingyi Optoelectronics Delivers a Domestic Solution  

In 2025, global competition in precision manufacturing has shifted down to the nanoscale microscopic dimension. For instance:  
- A 1-nm deviation in the gate oxide layer thickness of a 3-nm chip can cause overall product yield to plummet by 30%;  
- An anti-reflection (AR) coating error exceeding 2 nm on AR display lenses results in pronounced image ghosting;  
- Substandard passivation film thickness on photovoltaic panels directly reduces photoelectric conversion efficiency by over 2%.  

Clearly, achieving full-process, non-destructive, and high-precision thin-film thickness measurement has become a shared core requirement across multiple advanced manufacturing sectors.  

Traditional thin-film thickness measurement solutions face evident limitations:  
- Contact probes risk scratching costly, delicate thin-film samples;  
- X-ray-based methods entail radiation hazards and require complex sample preparation;  
- Conventional optical thickness meters typically rely on a single algorithm, yielding measurement errors exceeding 5 nm for novel composite materials or multilayer films—far below process control requirements.  

To address this industry-wide pain point, Jingyi Optoelectronics has launched the FILMTHICK-C10 Thin-Film Thickness Analyzer—a fully indigenous solution featuring end-to-end technological breakthroughs spanning both hardware architecture and software algorithms.  

The FILMTHICK-C10 employs an in-house-developed narrowband coherent light interferometric detection architecture. Its hermetically sealed, long-life tungsten-halogen light source module achieves over 10,000 hours of continuous operation—eliminating frequent recalibration or replacement and significantly reducing production-line maintenance costs. Unlike conventional instruments that output only a single thickness value per measurement, the FILMTHICK-C10 delivers three core parameters—film thickness, reflectance, and color—in a single, non-contact scan. This ensures zero damage even to nanoscale biological coatings or flexible electronic films, seamlessly meeting dual demands: research-grade precision and full-process monitoring on mass-production lines.  

Its companion OPTICAFILMTEST analysis system overcomes the industry’s reliance on single-algorithm approaches by integrating three high-precision algorithms: Fourier spectral analysis, precise peak localization, and multi-parameter fitting. The system incorporates an optical database of over 1,000 material refractive indices and supports user-uploaded optical parameters for newly developed materials—enabling rapid adaptation of optimal measurement logic even for cutting-edge specialty thin films. During measurement, it displays real-time interference waveforms, FFT spectra, and thickness trend curves—empowering engineers to swiftly identify and resolve process anomalies.  

In semiconductor manufacturing, the FILMTHICK-C10 covers the entire wafer processing chain—from epitaxial layers to metal interconnect coatings. After adoption by a domestic wafer fab, gate oxide layer measurements at the 14-nm node achieved stable sub-0.2-nm measurement error; product yield increased by 12% compared with prior imported equipment, while inspection costs dropped by 40%. In optical coating applications, the instrument supports simultaneous analysis of up to 20-layer multilayer structures—accurately measuring individual layer thicknesses for antireflection coatings on automotive lenses, PV panel passivation films, and complex multilayer stacks in AR eyewear. Following its deployment to replace legacy imported metrology tools, a domestic optical enterprise raised its coating yield from 82% to 94%, and inspection throughput quadrupled.  

Beyond semiconductors and optics, the FILMTHICK-C10 serves diverse application domains—including biomedicine, new energy, and environmental monitoring:  
- In biopharmaceuticals, it measures thicknesses of drug-release coatings, enabling precise control of therapeutic release kinetics;  
- In new energy applications, it assesses coating uniformity on lithium-ion battery electrode foils—reducing thermal runaway risks;  
- In environmental monitoring, it quantifies deposition thicknesses of airborne pollutants on sampling substrates, delivering accurate data for pollution source attribution.  

Jingyi Optoelectronics continues pushing the technological frontier of thin-film metrology. Currently underway is the integration of the FILMTHICK series with industrial-scale AI large models. Future iterations will enable automatic root-cause tracing of anomalous thickness data and autonomous adjustment of coating process parameters—truly unifying coating fabrication and metrology into a closed-loop, fully automated workflow. This advancement provides robust, foundational metrological support for China’s advanced manufacturing upgrade.  

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